ENZO TECH Forged Copper Heat Dissipation MOSFET Heatsink (10pcs) - MOS-C1-LE

Description

ENZOTECH MOS-C1-LE heatsinks were designed to offer exceptional heat dissipation for integrated MOSFET motherboards and video cards. MOS-C1-LE heatsinks are made using a forged copper process which produces a dense material that is extremely efficient at heat extraction. The MOS-C1-LE heatsink is far superior to traditional heat sinks currently found on the market and it provides the best thermal conductivity available to dissipate heat from the MOSFET in your system.
Compatible with all the Motherboards
Pure forged copper
Easy installation by using 3M™ 8815 Thermal Tape
Multipack - Ten (10) piece set
Dimensions (mm)
6.5(L) mm x6.5mm(W) x12mm(H)
Material
C1100 Forged Copper
Finish
Matt Black
Weight
2g (Each)
Thermal Adhesive
3M™ 8815 Thermal TapeENZOTECH MOS-C1-LE heatsinks were designed to offer exceptional heat dissipation for integrated MOSFET motherboards and video cards. MOS-C1-LE heatsinks are made using a forged copper process which produces a dense material that is extremely efficient at heat extraction. The MOS-C1-LE heatsink is far superior to traditional heat sinks currently found on the market and it provides the best thermal conductivity available to dissipate heat from the MOSFET in your system.
Compatible with all the Motherboards
Pure forged copper
Easy installation by using 3M™ 8815 Thermal Tape
Multipack - Ten (10) piece set
Dimensions (mm)
6.5(L) mm x6.5mm(W) x12mm(H)
Material
C1100 Forged Copper
Finish
Matt Black
Weight
2g (Each)
Thermal Adhesive
3M™ 8815 Thermal Tape