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Enzotech BCC9-LE Low Profile Copper BGA Heatsinks (8 Pcs)
Enzotech BCC9-LE Low Profile Copper BGA Heatsinks (8 Pcs)

Enzotech BCC9-LE Low Profile Copper BGA Heatsinks (8 Pcs)

$ 14.77

Availability: 33 in stock
  • To Fit: RAM
  • All returns accepted: ReturnsNotAccepted
  • Type: Heatsink
  • MPN: BCC9-LE
  • Brand: Enzotech
  • Condition: New
  • UPC: Does not apply
  • Model: BCC9-LE

    Description

    BCC9-LE is a low profile version of the BMR-C1 that has a refined fin height and base thickness. Will work with specific applications that has low clearance.
    ATI® & NVIDIA® Compatible
    Pure forged copper
    Easy installation by using 3M™ 8815 Thermal Tape
    Multipack - Eight (8) piece set
    Low profile
    Dimensions (mm) 14(L) mm x 14mm(W) x 9mm(H)
    Material C1100 Forged Copper
    Finish Matt Black
    Weight 5g (Each)
    Thermal Adhesive 3M™ 8815 Thermal Tape